Binary Mask(即BIM,二元掩模)是半导体光刻工艺中应用最广泛的进阶型掩模,由透光区(石英基板)与遮光区(铬层)构成明暗图形,可靠性高、通用性强。
其产品结构为石英基板(SiO2)、金属层(Cr)、光阻(PR,即光刻胶),是成熟制程的进阶光掩模方案。

| Part Number | SMTC-BIM-F-6025 | |||
| Resist | Type | FEP-171 | ||
Thickness (Å) | 2900~3100 Range≤100 | |||
| Metal Film | Thickness (Å) | 680~780 | ||
光学密度 OD | 3.1±0.2 λ=248nm | |||
Reflectivity(%) | 18.0±2 λ=248nm | |||
| Substrate | Type | Quartz | ||
Dimension (mm) | 152.0×152.0±0.4 | |||
Thickness (mm) | 6.35±0.1 | |||
Flatness (μm) | ≤1≤0.5 | |||